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        軟件設計工程師英文簡歷
        
            
        
                時間：2024-07-01 08:36:11 
                
                英文簡歷模板
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        軟件設計工程師英文簡歷模板
        
                
        
	　　簡歷是求職者給招聘單位發的一份簡要介紹。包含自己的基本信息：姓名、性別、年齡、民族、籍貫、政治面貌、學歷、聯系方式，以及自我評價、工作經歷、學習經歷、榮譽與成就、求職愿望、對這份工作的簡要理解等�，F在一般找工作都是在通過網絡來找，因此一份良好的個人簡歷對于獲得面試機會至關重要。
        軟件設計工程師英文簡歷模板
        

        
	　　以下是yjbys小編分享的軟件設計工程師英文簡歷模板，更多內容請訪問(jianlli.yjbys.com)。
        

        
	
		
        
			
				Name：yjbys
			
				Hukou： 
		
        
		
        
			
				Residency：Shanghai
			
				Work Experience： 
		
        
		
        
			
				Current Salary： 
			
				Tel：1 
		
        
		
        
			
				E-mail：www.ruiwen.com/jianli
		
        
		
        
			
				Career Objective
		
        
		
        
			
				Desired Industry：
			
				Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, Certification
		
        
		
        
			
				Desired Position：
			
				Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist Staff
		
        
		
        
			
				Desired address：
			
				Shanghai ,Hongkong ,Beijing ,Taiwan ,Macao
			
				Desired Salary：
			
				Negotiable
		
        
		
        
			
				Work Experience
		
        
		
        
			
				2006/06—Present
			
				***Company
		
        
		
        
			
				 
			
				Industry: Electronics/Semiconductor/IC
        
				Intel Flash Engineering Department Individual Contributor 
        
				Responsibilities：
        
				I have been working in Intel Flash Assembly & Test Engineering
        
				Department as an Individual Contributor since June of 2006.
        
				Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:
        
				
          
					
        1. 
						The yield of year 2006 has been dramatically increased than that of year 2005.
          2. 
					
        2. 
						The yield of all products, consecutively meets the goal.
          3. 
					
        3. 
						The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.
          4. 
				
        
				Report Directly to: Department ManagerNumber of Subordinate: 14
        
				Reference: Bao Powel
        
				Achievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.
        
				Our efforts are paid off:
        
				
          
					
        1. 
						The yield of year 2006 has been dramatically increased than that of year 2005.
          2. 
					
        2. 
						The yield of all products, consecutively meets the goal.
          3. 
					
        3. 
						The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.
          4. 
				
        
			        		
		
        
		
        
			
				2006/01—2006/05
			
				Intel(Shanghai) Technology Development Ltd. Company
		
        
		
        
			
				 
			
				Industry: Electronics/Semiconductor/IC
        
				Intel STTD-China Department Electronics Development Engineer 
        
				Responsibilities：
        
				
          
					
        1. 
						I had been working in STTD-China since Jan 2006 to May 2006 as a senior module engineer.
          2. 
					
        2. 
						At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.
          3. 
				
        
				Report Directly to: Hopman Mark   Number of Subordinate: 14
        
				Reference: Bao Powel
        
				Reason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal re-organization in June of 2006.
        
				Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.        		
		
        
		
        
			
				2005/05—2006/01
			
				Nanyang University of Science & Technology
		
        
		
        
			
				 
			
				Industry: Electronics/Semiconductor/IC
        
				Electronics & Electrical Engineering Department Research Fellow 
        
				Responsibilities：
        
				
          
					
        1. 
						I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow.
          2. 
					
        2. 
						I majored at Gate Oxide Reliability Research in the duration.
          3. 
				
        
				Report Directly to: Professor Pey Kin Leoh 
        
				Subordinate: 3
        
				Reference: Patrick Low
        
				Reason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job.
        
				Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.        		
		
        
		
        
			
				Project Experience
		
        
		
        
			
				2008/01—Present
			
				Assembly NPI (New Product Introduction)
		
        
		
        
			
				 
			
				Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.
        
				Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.        		
		
        
		
        
			
				2007/01—2007/12
			
				Marginal Electrical Boards Rescue
		
        
		
        
			
				 
			
				Project Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally.
        
				Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress.        		
		
        
		
        
			
				2006/10—2007/05
			
				Optimization the current Test Process Order for Flash Memory
		
        
		
        
			
				 
			
				Project Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.
        
				Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement.        		
		
        
		
        
			
				2006/05—2006/12
			
				Test Yield of Flash memory Improvement
		
        
		
        
			
				 
			
				Project Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.
        
				Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.        		
		
        
		
        
			
				Education and Training 
		
        
		
        
			
				2005/05—2006/01
			
				Nanyang University of Science & Technology Microelectronics Doctorate
		
        
		
        
			
				 
			
				I worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration.
		
        
		
        
			
				2004/03—2005/03
			
				Seoul National University of Korea Microelectronics Others
		
        
		
        
			
				 
			
				I had been working in National Physical Lab of Seoul National University in Korea since March of 2004 to March of 2005 as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology.
		
        
		
        
			
				2001/03—2004/03
			
				Shanghai Institute of Microsystems and Information Technology，Chinese Academy of Sciences Information Technology Doctorate
		
        
		
        
			
				1998/09—2001/03
			
				Nanjing University of Science & Technology Material Science and Engineering Master
		
        
		
        
			
				 
			
				Being a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics.
		
        
		
        
			
				1993/09—1997/07
			
				Nanjing University of Science & Technology Material Science and Engineering Bachelor
		
        
		
        
			
				1997/07—1998/07
			
				Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification Department
		
        
		
        
			
				Professional Skills
		
        
		
        
			
				Language Skills：
			
				English: EXCELLENT
        
				Korean: AVERAGE        		
		
        
		
        
			
				Computer Skills：
			
				Technology   skilled 96Month
        
				SAP   understanding 8Month        		
		
        
		
        
			
				Certificate：
			
				2000/11  MCSE
        
				1999/06  CET6        		
		
        
		
        
			
				Self-appraisal
		
        
		
        
			
				7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.
		
        
	        

        

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